Ntle le liboto tse tloaelehileng tsa PCB, PCB ShinTech e boetse e ipapisitse le li-PCB tsa boleng bo holimo tse Rigid-flex, liboto tse boima tsa koporo, liboto tsa HDI tse nang le ELIC, RF/Microwave circuit boards, High speed digital PCBs, Ceramic PCBs, Metal core PCBs, le litlhoko tse ling. ho kenyelletsa theknoloji ea morao-rao, bakeng sa mefuta e fapaneng ea liindasteri ho tloha mehala ea puisano ho ea ho tsa bongaka, taolo ea indasteri, lisebelisoa tsa motlakase tsa bareki, sesole le sefofane, likoloi le tse ling.PCBShinTech e tla u boloka u le morao-rao ka tsoelo-pele e tsoetseng pele e fumanehang 'marakeng kajeno.
Haholo-holo bakeng sa li-PCB tse tsoetseng pele, PCB ShinTech e utloisisa tlhoko ea boleng.Re etelletsa boleng le ho tšepahala pele.Li-PCB tsa rona kaofela li latela melao ea RoHS 'me li lekoa le ho netefatsoa ka ISO9001, TS16949 le UL.Ba bang ba na le AS9100.Re bolelle ka litlhaloso kapa litlhoko tsa liboto tsa potoloho tse hatisitsoeng litlhoko tsa hau.Re tla qotsa litheko tse baballang haholo bakeng sa hau.
Tsebo
• PCB mofuta Rigid, Flexible, Rigid-Flexible
• Palo ea lera 1-50 Layer
• Qty req.>=1 prototype, phetoho e potlakileng, taelo e nyane, tlhahiso ea bongata
• Materials FR-4, High TG FR-4, Rogers, Polyimide, Aluminium Clad, Metal core,Ba bang
• Mocheso o Phahameng, Lisebelisoa tsa Maqhubu a Phahameng
• Ho qeta koporo 0.5-18oz
• Min line trace/sebaka 0.002/0.002" (2/2mil kapa 0.05/0.05mm)
• Boholo bofe kapa bofe ba ho Sebetsa lipakeng tsa 0.004" le 0.350"
• Solder Mask Customizable
• Silkscreen Color Customizable
• Tšitiso e Laoloang
• Surface Finish HASL, OSP, Nickle, Immersion Gold, Imm Tin, Imm Silver, joalo-joalo.
• E lumellana le RoHS
• Teko ea Motlakase ea 100% e kenyelelitsoe
• IPC600 Sehlopha sa II kapa Maemo a holimo
• ISO-9001, ISO-14000, UL, TS16949, ka linako tse ling AS9100 Certified
Lead time
5-15 letsatsi la mosebetsi, tlhahiso e hlakileng le thomello e reriloeng e fumaneha.Ka kopo ikopanye le baemeli ba rona ba thekiso bakeng sa lintlha.
Linyeoe
lintho tse bonahalang: FR-4 TG170
Likarolo:12
Botenya ba Boto: 2 mm
Min.Pina/Sebaka: 3/3mil
Min Hole Size: 0.15mm
Surface Finish: Ho qoelisoa khauta
Kopo: Tlhokomelo ea Tšireletso
Lintho tse bonahalang: TLY-5 + S1000-2M
Likarolo: 6
Botenya ba Boto: 1.6mm
Min.Pina/Sebaka: 3/3mil
Min Hole Size: 0.15mm
Surface Finish: Ho qoelisoa khauta
Kopo: puisano ea mohala
Boitsebiso: FR-4 + FCCL
Likarolo: 10 e thata + 4 e fetohang
Botenya ba Boto: 1.0 mm
Min.Pina/Sebaka: 4/4mil
Min Hole Boholo: 0.20 mm
Surface Finish: Ho qoelisoa khauta
Kopo: Bongaka
lintho tse bonahalang: FR-4
Likarolo: 6
Botenya ba Boto: 2 mm
Min.Track/Spacing: 10/10mil
Min Hole Boholo: 0.4 mm
Botenya ba Koporo: 10 oz
Surface Finish: Ho qoelisoa khauta
Kopo: Matla
Romella potso ea hau kapa kopo ea quote ho rona hosales@pcbshintech.comho hokahana le e mong oa baemeli ba rona ba thekiso ba nang le boiphihlelo ba indasteri ho o thusa ho fumana mohopolo oa hau ho mmarakeng.
