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PCB Fabrication & PCB Kopano Matla

Matla a Tlhahiso ea PCB

Lintho PCB e tloaelehileng PCB e tsoetseng pele
Bokhoni ba Tlhahiso 40,000 m2ka khoeli 40,000 m2ka khoeli
Lera 1, 2, 4, ho fihla ho 10 mekhahlelo 1, 2, 4, ho fihlela ho 50 mekhahlelo
Lintho tse bonahalang FR-4, CEM-1, Aluminium, joalo-joalo. FR-4 (Tl e Tloaelehileng ho ea holimo Tg), High CTI FR-4, CEM-1, CEM-3, Polymide (PI), Rogers, Glass Epoxy, Aluminium Base, Rohs Compliant, RF, joalo-joalo.
Mofuta oa PCB Regid E thata, e tenyetseha, e thata-ea Fetohang
Min.Botenya ba Konokono 4mil/0.1mm(2-12 layer), 2mil/0.05mm (≥13layer) 4mil/0.1mm(2-12 layer), 2mil/0.06mm (≥13layer)
Mofuta oa Prepreg 1080, 2116, 765-8, 106, 3313, 2165, 1500 1080, 2116, 765-8, 106, 3313, 2165, 1500
Boholo ba Boto 26''*20.8'/650mm*520mm Customizable
Botenya ba Boto 0.4mm/16mil-2.4mm/96mil 0.2mm/8mil-10.0mm/400mil
Botenya Mamello ± 0.1mm (Botenya ba Boto <1.0mm);±10% (Botenya ba Boto≥1.0mm) ± 0.1mm (Botenya ba Boto <1.0mm);± 4% (Botenya ba Boto≥1.0mm)
Ho kgeloha ha dimensional ±0.13mm/5.2mil ±0.10mm/4 mil
Warping angle 0.75% 0.75%
Botenya ba Koporo 0.5-10 oz 0.5-18 oz
Mamello ea Botenya ba Koporo ±0.25 oz ±0.25 oz
Min.Bophara ba Mola/Sebaka 4mil/0.1mm 2mil/0.05mm
Min.Drill Hole Diameter 8mil/0.2mm (mochini) 4mil/0.1mm (laser), 6mil/0.15mm (mochini)
PTH Botenya ba Lerako ≥18μm ≥20μm
PTH Hole Mamello ±3mil/0.076mm ±2mil/0.05mm
NPTH Hole Mamello ±2mil/0.05mm ±1.5mil/0.04mm
Max.Aspect ratio 12:1 15:1
Min.Sefofu/Ho Patoa Ka 4mil/0.1mm 4mil/0.1mm
Surface Finish HASL, OSP, Khauta e Kentsoeng HASL, OSP, Nickle, Emmersion Gold, Imm Tin, Imm Silver, joalo-joalo.
Mask ea solder Botala, Bofubedu, Bosweu, Bosehla, Boputswa, Botsho Botala, Bokhubelu, Bosoeu, Bosehla, Botala, Botšo, Orange, Pherese, joalo-joalo Customizable
Solder Mask e fokotsehile ±3mil/0.076mm ±2mil/0.05mm
Silkscreen Color Botala, Bofubedu, Bosweu, Bosehla, Boputswa, Botsho Botala, Boputsoa, ​​Botsho, Bosweu, Bofubedu, Pherese, E bonaletsang, Bosweu, Bosehla, Namunu, jj. Customizable
Silkscreen Min.Bophara ba Mola 0.006'' kapa 0.15mm 0.006'' kapa 0.15mm
Taolo ea Impedans ±10% ±5%
Mamello ea Sebaka sa Hole ±0.05mm, ±0.13mm (2ndphunya lesoba ho 1stsebaka sa lesoba) ±0.05mm, ±0.13mm (2ndphunya lesoba ho 1stsebaka sa lesoba)
PCB Cutting Shear, V-Score, Tab-routed Shear, V-Score, Tab-routed
Liteko le tlhahlobo AOI, Teko ea Fly Probe, Teko ea ET, Tlhahlobo ea Microsection, Teko ea Solderability, Teko ea Impedans, joalo-joalo. AOI, Teko ea Fly Probe, Teko ea ET, Tlhahlobo ea Microsection, Teko ea Solderability, Teko ea Impedans, joalo-joalo.
Boemo ba Boleng Sehlopha sa II sa IPC IPC Sehlopha sa II, IPC Sehlopha sa III
Setifikeiti UL, ISO9001:2015, ISO14001:2015, TS16949:2009, RoHS joalo-joalo. UL, ISO9001:2008, ISO14001:2008, TS16949:2009, AS9100, RoHS, joalo-joalo.

Bokhoni ba Kopano ea PCB

Litšebeletso Turnkey-ho tloha tlhahiso ea liboto tse se nang letho, Ho fumana likarolo, kopano, sephutheloana, phano;Lits'ebetso tsa kitted/partial turkey-partial process tsa lenane le kaholimo ho latela litlhoko tsa moreki.
Lisebelisoa Mehala e 15 ea SMT ka tlung, mela e 3 ea ka tlung ka har'a lesoba, mela e 3 ea kopano ea ho qetela ka tlung.
Mefuta SMT, Thru-hole, Mixed (SMT/Thru-hole), sebaka se le seng kapa habeli
Lead time Quickturn, Prototype kapa chelete e nyane: matsatsi a 3-7work matsatsi (likarolo tsohle li lokile).Taelo ea 'Misa: Matsatsi a 7-28 a mosebetsi (likarolo tsohle li lokile);Ho fihla ho nako ho teng
Teko ka Lihlahisoa Tlhahlobo ea X-ray, ICT (Teko ea Potoloho), Tlhahlobo ea 100% BGA X-Ray, Tlhahlobo ea AOI (Tlhahlobo e Ikemetseng ea Optical), Testing Jig / Mold, Teko ea Ts'ebetso, Tlhahlobo ea Karolo ea Counterfeit (bakeng sa mofuta oa kopano ea kitted), joalo-joalo.
Litlhaloso tsa PCB E thata, Metal Core, Flexible, Flex-Rigid
Bongata MOQ: 1 pc.Prototype, taelo e nyane, tlhahiso ea bongata
Likarolo tsa ho reka Turnkey, Kitted/ Boetsuwa bo sa fellang
Li-stencials Laser seha tšepe e sa hloekang
Nano-coating e fumaneha
Mefuta ea soldering Li-Fluxes tse Hloekileng, tse Hloekileng, tse Hloekileng ka Metsi, tse tsamaellanang le RoHS, tse Hloekileng le tse Hloekileng
Lifaele Tse Hlokahalang PCB: Lifaele tsa Gerber (CAM, PCB, PCBDOC)
Likaroloana: Bili ea Lisebelisoa (Lethathamo la BOM)
Kopano: Khetha & Beha faele
PCB Panel boholo Min.Boholo: 0.25 * 0.25 inch (6mm * 6mm)
Boholo: 48 * 24 inch (1200mm * 600mm)
Lintlha tsa likarolo Passive Down ho fihlela boholo ba 01005
BGA le Ultra-Fine (uBGA)
Li-Leadless Chip Carriers / CSP
Quad Flat Package No-Lead (QFN)
Sephutheloana sa Quad Flat (QFP)
Plastic Leaded Chip Carrier (PLCC)
SOIC
Sephutheloana se On-Package (PoP)
Sephutheloana sa Chip e Nyane (Boemo bo Botle ho isa ho 0.02mm/0.8 mils)
Kopano ea SMT e mahlakoreng a mabeli
ho beha othomathike ea Ceramic BGA, Plastic BGA, MBGA
Ho tlosa le ho fetola BGA's & MBGA's, ho theohela ho 0.35mm pitch, ho fihla ho 45mm
BGA Tokiso le Reball
Ho Tlosoa ha Karolo le Phetoho
Mohala le Mohala
Sephutheloana sa likarolo Seha Tape, Tube, Reels, Reel Karolo, Terene, Bongata, Likarolo tse Lose
Boleng IPC Sehlopha sa II / IPC Sehlopha sa III
Tse Ling Tsebo Tlhahlobo ea DFM
Ho Hloekisa ka Metsi
Ho roala ka mokhoa o hlophisitsoeng
Litšebeletso tsa tlhahlobo ea PCB

Tsamaiso ea Boleng

Boleng ke ntho e tlang pele ho rona.PCB ShinTech e na le mokhoa o lebisitsoeng ho etsa bonnete ba hore li-PCB tsa hau lia hlahisoa le ho bokelloa ka boleng bo holimo le bo tsitsitseng.Ha ho na letho ho PCB ShinTech le setseng ka monyetla.Re sebetsa ka thata maemong ohle a ts'ebetso ho etsa bonnete ba hore ts'ebetso e 'ngoe le e' ngoe e hlalosoa le hore litaelo tsa mosebetsi li ngotsoe e le hore re ka lula re fana ka lihlahisoa le litšebeletso tsa boemo bo holimo ho bareki ba rona.

1. Utloisisa litebello le litlhoko tsa bareki.

2. Tsoela pele ho theha le ho fana ka litekanyetso tse ncha ho bareki.

3. Karabo ho tletlebo ea bareki hang-hang.Haeba re e-na le bothata, re tšoara ketsahalo e 'ngoe le e 'ngoe e joalo e le monyetla oa ho ithuta se ileng sa senyeha, le mokhoa oa ho thibela ho etsahala hape.

4. Theha tsamaiso ea boleng bo sebetsang hantle le ho ntlafatsa katleho ea tsamaiso ka ho tsoelang pele.

Re khutlisa boleng ba li-PCB tsa hau le PCBA ka ho lokisetsa lisebelisoa tse nepahetseng, ho sebelisa thepa e nepahetseng, ho reka thepa e nepahetseng, ho kenya ts'ebetsong ts'ebetso e nepahetseng, le ho hira le ho koetlisa basebetsi ba nepahetseng.Odara e 'ngoe le e 'ngoe e feta mekhoeng e ts'oanang e laoloang ka thata ka sepheo sa hore eseng feela ho eketsa ts'ebetso molemong oa bareki ba rona empa ka sepheo sa mantlha sa ho lula re fana ka sehlahisoa sa boleng bo hahelletsoeng ho latela litebello tsa moreki le litlhaloso tsa boto.

Lisebelisoa le lisebelisoa tsa ka tlung

Lisebelisoa tsa ka tlung tsa PCB ShinTech li khona ho fihla ho 40,000 m2ka khoeli ea ho etsoa ha PCB.Ka nako e ts'oanang PCB ShinTech e na le mela e 15 ea SMT le mela e 3 ea lesoba ka tlung.Li-PCB tsa hau ha li mohla li hlahisoang ke moreki ea tlase ho tsoa letamong le leholo la lifeme.Ho fihlela ts'ebetso e ikhethang ea boleng ho tsoa kopanong ea PCB, re tsoela pele ho tsetela lisebelisoa tsa morao-rao tse lumellang ho nepahala ho hlokahalang bakeng sa ts'ebetso eohle ea kopano, ho kenyeletsoa X Ray, peista ea solder, khetho le sebaka le tse ling.

Koetliso ea basebetsi

Setsi se seng le se seng sa PCB ShinTech sa tlhahiso le kopano se na le bahlahlobi ba koetlisitsoeng ka botlalo, hobane sepheo sa rona sa bohlokoahali ke ho fana ka boleng.Koetliso ea basebetsi e bohlokoa.Ke mosebetsi oa motho e mong le e mong ea sebetsang ho hlahloba liboto ha li ntse li tsoela pele, 'me re etsa bonnete ba hore li fumane koetliso e feletseng le tsebo e hlokahalang.

Tlhahlobo le teko

Ehlile, tlhahlobo le liteko li boetse li totobatsoa tsamaisong ea boleng ba PCB ShinTech.Re sebelisa tsena ho etsa bonnete ba hore lits'ebetso tsa rona li sebetsa ka nepo.Mehato ena e u fa tiisetso e eketsehileng ea hore boto eo u e fumanang e nepahetse ho moralo oa hau 'me e tla sebetsa ka nepo bophelong bohle ba sehlahisoa sa hau.Re tsetetse ho thepa ea X-ray fluorescent, AOI, fly probe tester, motlakase le tse ling molemong ona.Bareki ba bangata ha ba na lisebelisoa tsa ho etsa lintho ka tlung.Re nka boikarabelo ba ho netefatsa hore moreki e mong le e mong o fumana seo a se hlokang.

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Mehato ena e hlalosoa e le ka tlase.

BARE PCB BOARD KHOTSO

● Tlhahlobo ea optical e iketsang (AOI) & tlhahlobo ea pono

● Digital microscopy

● Micro-sectioning

● Tlhahlobo e tsoelang pele ea lik'hemik'hale ea mekhoa ea metsi

● Tlhahlobo e sa khaotseng ea mefokolo le likhechana tse nang le liketso tsa ho lokisa

● Teko ea motlakase e kenyelelitsoe litšebeletsong tsohle

● Litekanyo bakeng sa impedance e laoloang

● Polar Instruments software bakeng sa moralo oa meaho e laoloang ea impedance le li-coupons tsa liteko.

KOPANO YA PCB

● Boto e se nang letho le tlhahlobo ea likarolo tse kenang

● Licheke tsa pele

● Tlhahlobo ea optical e iketsang (AOI) & tlhahlobo ea pono

● Tlhahlobo ea X-ray ha ho hlokahala

● Teko ea tšebetso ha ho hlokahala

Lisebelisoa le Thepa

Lisebelisoa tsa ka tlung tsa PCB ShinTech li khona ho fihla ho 40,000 m2ka khoeli ea ho etsoa ha PCB.Ka nako e ts'oanang PCB ShinTech e na le mela e 15 ea SMT le mela e 3 ea lesoba ka tlung.Li-PCB tsa hau ha li mohla li hlahisoang ke moreki ea tlase ho tsoa letamong le leholo la lifeme.Ho fihlela ts'ebetso e ikhethang ea boleng ho tsoa kopanong ea PCB, re tsoela pele ho tsetela lisebelisoa tsa morao-rao tse lumellang ho nepahala ho hlokahalang bakeng sa ts'ebetso eohle ea kopano, ho kenyeletsoa X Ray, peista ea solder, khetho le sebaka le tse ling.

1. PCB

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2. PCBA

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Setifikeiti

Litsi tsa rona li na le litifikeiti tsena:

● ISO-9001: 2015

● ISO14001: 2015

● TS16949: 2016

● UL: 2019

● AS9100: 2012

● RoHS: 2015

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