PCB Fabrication & PCB Kopano Matla
Matla a Tlhahiso ea PCB
| Lintho | PCB e tloaelehileng | PCB e tsoetseng pele |
| Bokhoni ba Tlhahiso | 40,000 m2ka khoeli | 40,000 m2ka khoeli |
| Lera | 1, 2, 4, ho fihla ho 10 mekhahlelo | 1, 2, 4, ho fihlela ho 50 mekhahlelo |
| Lintho tse bonahalang | FR-4, CEM-1, Aluminium, joalo-joalo. | FR-4 (Tlhōlo ho ea holimo Tg), High CTI FR-4, CEM-1, CEM-3, Polymide (PI), Rogers, Glass Epoxy, Aluminium Base, Rohs Compliant, RF, joalo-joalo. |
| Mofuta oa PCB | E thatafetse | E thata, e tenyetseha, e thata-ea Fetohang |
| Min.Botenya ba mantlha | 4mil/0.1mm(2-12 layer）, 2mil/0.05mm (≥13layer) | 4mil/0.1mm(2-12 layer）, 2mil/0.06mm (≥13layer) |
| Mofuta oa Prepreg | 1080, 2116, 765-8, 106, 3313, 2165, 1500 | 1080, 2116, 765-8, 106, 3313, 2165, 1500 |
| Boholo ba Boto | 26''*20.8'/650mm*520mm | Customizable |
| Botenya ba Boto | 0.4mm/16mil-2.4mm/96mil | 0.2mm/8mil-10.0mm/400mil |
| Botenya Mamello | ± 0.1mm (Botenya ba Boto <1.0mm);±10% (Botenya ba Boto≥1.0mm) | ± 0.1mm (Botenya ba Boto <1.0mm);± 4% (Botenya ba Boto≥1.0mm) |
| Ho kgeloha ha dimensional | ±0.13mm/5.2mil | ±0.10mm/4 mil |
| Warping angle | 0.75% | 0.75% |
| Botenya ba Koporo | 0.5-10 oz | 0.5-18 oz |
| Mamello ea Botenya ba Koporo | ±0.25 oz | ±0.25 oz |
| Min.Bophara ba Mola/Sebaka | 4mil/0.1mm | 2mil/0.05mm |
| Min.Drill Hole Diameter | 8mil/0.2mm (mochini) | 4mil/0.1mm (laser), 6mil/0.15mm (mochini) |
| PTH Botenya ba Lerako | ≥18μm | ≥20μm |
| PTH Hole Mamello | ±3mil/0.076mm | ±2mil/0.05mm |
| NPTH Hole Mamello | ±2mil/0.05mm | ±1.5mil/0.04mm |
| Max.Aspect ratio | 12:1 | 15:1 |
| Min.Sefofu/Ho Patoa Ka | 4mil/0.1mm | 4mil/0.1mm |
| Surface Finish | HASL, OSP, Khauta e Kentsoeng | HASL, OSP, Nickle, Khauta e Kentsoeng, Imm Tin, Imm Silver, joalo-joalo. |
| Mask ea solder | Botala, Bofubedu, Bosweu, Bosehla, Boputswa, Botsho | Botala, Bokhubelu, Bosoeu, Bosehla, Botala, Botšo, Orange, Pherese, joalo-joalo. Customizable |
| Solder Mask e fokotsehile | ±3mil/0.076mm | ±2mil/0.05mm |
| Silkscreen Color | Botala, Bofubedu, Bosweu, Bosehla, Boputswa, Botsho | Botala, Boputsoa, Botsho, Bosweu, Bofubedu, Pherese, E bonaletsang, Boputswa, Bosehla, Namunu, jj. Customizable |
| Silkscreen Min.Bophara ba Mola | 0.006'' kapa 0.15mm | 0.006'' kapa 0.15mm |
| Taolo ea Impedans | ±10% | ±5% |
| Mamello ea Sebaka sa Hole | ±0.05mm, ±0.13mm (2ndphunya lesoba ho 1stsebaka sa lesoba) | ±0.05mm, ±0.13mm (2ndphunya lesoba ho 1stsebaka sa lesoba) |
| PCB Cutting | Shear, V-Score, Tab-routed | Shear, V-Score, Tab-routed |
| Liteko le tlhahlobo | AOI, Teko ea Fly Probe, Teko ea ET, Tlhahlobo ea Microsection, Teko ea Solderability, Teko ea Impedance, joalo-joalo. | AOI, Teko ea Fly Probe, Teko ea ET, Tlhahlobo ea Microsection, Teko ea Solderability, Teko ea Impedance, joalo-joalo. |
| Maemo a Boleng | Sehlopha sa II sa IPC | IPC Sehlopha sa II, IPC Sehlopha sa III |
| Setifikeiti | UL, ISO9001:2015, ISO14001:2015, TS16949:2009, RoHS joalo-joalo. | UL, ISO9001:2008, ISO14001:2008, TS16949:2009, AS9100, RoHS, joalo-joalo. |
Bokhoni ba Kopano ea PCB
| Litšebeletso | Turnkey-ho tloha tlhahiso ea liboto tse se nang letho, Ho fumana likarolo, kopano, sephutheloana, phano;Lits'ebetso tsa Kitted/partial turkey-partial process tsa lenane le kaholimo ho latela litlhoko tsa moreki. |
| Lisebelisoa | Mehala e 15 ea SMT ka tlung, mela e 3 ea ka tlung ka har'a lesoba, mela e 3 ea kopano ea ho qetela ka tlung. |
| Mefuta | SMT, Thru-hole, Mixed (SMT/Thru-hole), sebaka se le seng kapa habeli |
| Lead time | Quickturn, Prototype kapa chelete e nyane: matsatsi a 3-7work matsatsi (likarolo tsohle li lokile).Taelo ea 'Misa: Matsatsi a 7-28 a mosebetsi (likarolo tsohle li lokile);Ho fihla ho nako ho teng |
| Teko ka Lihlahisoa | Tlhahlobo ea X-ray, ICT (In-Circuit Testing), 100% BGA X-Ray Inspection, AOI Testing (Automated Optical Inspection), Testing Jig / Mold, Teko ea Ts'ebetso, Tlhahlobo ea Counterfeit Component (bakeng sa mofuta oa kopano ea kitted), joalo-joalo. |
| Litlhaloso tsa PCB | E thata, Metal Core, Flexible, Flex-Rigid |
| Bongata | MOQ: 1 pc.Prototype, taelo e nyane, tlhahiso ea bongata |
| Likarolo tsa ho reka | Turnkey, Kitted/ Boetsuwa bo sa fellang |
| Li-stencials | Laser khaola tšepe e sa hloekang |
| Nano-coating e fumaneha | |
| Mefuta ea soldering | Metsi a eteletsoeng pele, a se nang lead, a lumellana le RoHS, a sa hloekang le a Hloekileng ka Metsi |
| Lifaele Tse Hlokahalang | PCB: Lifaele tsa Gerber (CAM, PCB, PCBDOC) |
| Likaroloana: Bili ea Lisebelisoa (Lethathamo la BOM) | |
| Kopano: Khetha & Beha faele | |
| PCB Panel boholo | Min.Boholo: 0.25 * 0.25 inch (6mm * 6mm) |
| Boholo: 48 * 24 inch (1200mm * 600mm) | |
| Lintlha tsa likarolo | Passive Down ho isa ho 01005 boholo |
| BGA le Ultra-Fine (uBGA) | |
| Li-Leadless Chip Carriers / CSP | |
| Quad Flat Package No-Lead (QFN) | |
| Sephutheloana sa Quad Flat (QFP) | |
| Plastic Leaded Chip Carrier (PLCC) | |
| SOIC | |
| Sephutheloana se On-Package (PoP) | |
| Sephutheloana sa Chip e Nyenyane (Boemo bo Botle ho isa ho 0.02mm/0.8 mils) | |
| Kopano ea SMT e mahlakoreng a mabeli | |
| ho beha othomathike ea Ceramic BGA, Plastic BGA, MBGA | |
| Ho tlosa le ho fetola BGA's & MBGA's, ho theohela ho 0.35mm pitch, ho fihla ho 45mm | |
| BGA Tokiso le Reball | |
| Ho Tlosa Karolo le Phetoho | |
| Mohala le Mohala | |
| Sephutheloana sa likarolo | Seha Tape, Tube, Reels, Reel e sa Feleng, Terene, Bongata, Likarolo tse Lose |
| Boleng | IPC Sehlopha sa II / IPC Sehlopha sa III |
| Tse Ling Tsebo | Tlhahlobo ea DFM |
| Ho Hloekisa ka Metsi | |
| Ho roala ka mokhoa o hlophisitsoeng | |
| Litšebeletso tsa tlhahlobo ea PCB |
Tsamaiso ea Boleng
Boleng ke ntho e tlang pele ho rona.PCB ShinTech e na le mokhoa o lebisitsoeng ho etsa bonnete ba hore li-PCB tsa hau lia hlahisoa le ho bokelloa ka boleng bo holimo le bo tsitsitseng.Ha ho na letho ho PCB ShinTech le setseng ka monyetla.Re sebetsa ka thata maemong ohle a ts'ebetso ho etsa bonnete ba hore ts'ebetso e 'ngoe le e' ngoe e hlalosoa le hore litaelo tsa mosebetsi li ngotsoe e le hore re ka lula re fana ka lihlahisoa le litšebeletso tsa boemo bo holimo ho bareki ba rona.
1. Utloisisa litebello le litlhoko tsa bareki.
2. Tsoela pele ho theha le ho fana ka litekanyetso tse ncha ho bareki.
3. Karabo ho tletlebo ea bareki hang-hang.Haeba re hlaheloa ke bothata, re tšoara ketsahalo e 'ngoe le e 'ngoe e joalo e le monyetla oa ho ithuta se ileng sa senyeha, le mokhoa oa ho thibela ho etsahala hape.
4. Theha tsamaiso ea boleng bo sebetsang hantle le ho ntlafatsa katleho ea tsamaiso ka ho tsoelang pele.
Re khutlisa boleng ba li-PCB tsa hau le PCBA ka ho lokisetsa lisebelisoa tse nepahetseng, ho sebelisa thepa e nepahetseng, ho reka thepa e nepahetseng, ho kenya ts'ebetso e nepahetseng, le ho hira le ho koetlisa basebetsi ba nepahetseng.Odara e 'ngoe le e 'ngoe e feta mekhoeng e ts'oanang e laoloang ka thata ka sepheo sa ho eketsa ts'ebetso molemong oa bareki ba rona feela empa ka sepheo sa mantlha sa ho fana ka sehlahisoa sa boleng bo holimo ho latela litebello tsa moreki le litlhaloso tsa boto.
Lisebelisoa le lisebelisoa tsa ka tlung
Lisebelisoa tsa ka tlung tsa PCB ShinTech li khona ho fihla ho 40,000 m2ka khoeli ea ho etsoa ha PCB.Ka nako e ts'oanang PCB ShinTech e na le mela e 15 ea SMT le mela e 3 ea lesoba ka tlung.Li-PCB tsa hau ha li mohla li hlahisoang ke moreki ea tlase ho tsoa letamong le leholo la lifeme.Ho fihlela ts'ebetso e ikhethang ea boleng ho tsoa kopanong ea PCB, re tsoela pele ho tsetela lisebelisoa tsa morao-rao tse lumellang ho nepahala ho hlokahalang bakeng sa ts'ebetso eohle ea kopano, ho kenyeletsoa X Ray, peista ea solder, khetho le sebaka le tse ling.
Koetliso ea basebetsi
Setsi se seng le se seng sa PCB ShinTech sa tlhahiso le kopano se na le bahlahlobi ba koetlisitsoeng ka botlalo, hobane sepheo sa rona sa bohlokoahali ke ho fana ka boleng.Koetliso ea basebetsi e bohlokoa.Ke mosebetsi oa motho e mong le e mong ea sebetsang ho hlahloba liboto ha li ntse li tsoela pele, 'me re etsa bonnete ba hore li fumane koetliso e feletseng le tsebo e hlokahalang.
Tlhahlobo le teko
Ehlile, tlhahlobo le liteko li boetse li totobatsoa ho sistimi ea taolo ea boleng ea PCB ShinTech.Re sebelisa tsena ho etsa bonnete ba hore lits'ebetso tsa rona li sebetsa hantle.Mehato ena e u fa tiisetso e eketsehileng ea hore boto eo u e fumanang e nepahetse ho moralo oa hau 'me e tla sebetsa ka nepo bophelong bohle ba sehlahisoa sa hau.Re tsetetse ho thepa ea X-ray fluorescent, AOI, fly probe tester, motlakase le tse ling molemong ona.Bareki ba bangata ha ba na lisebelisoa tsa ho etsa lintho ka tlung.Re nka boikarabelo ba ho netefatsa hore moreki e mong le e mong o fumana seo a se hlokang.
Mehato ena e hlalosoa e le ka tlase.
BARE PCB BOARD MOHAPI
● Ho itlhahloba ka tsela e iketsang (AOI) & tlhahlobo ea pono
● Digital microscopy
● Micro-sectioning
● Tlhahlobo e tsoelang pele ea lik'hemik'hale ea mekhoa ea metsi
● Tlhahlobo e sa khaotseng ea mefokolo le likhechana tse nang le liketso tsa ho lokisa
● Teko ea motlakase e kenyelelitsoe litšebeletsong tsohle
● Litekanyo bakeng sa impedance e laoloang
● Polar Instruments software bakeng sa moralo oa meaho e laoloang ea impedance le li-coupons tsa liteko.
KOPANO YA PCB
● Boto e se nang letho le tlhahlobo ea likarolo tse kenang
● Licheke tsa pele
● Ho itlhahloba ka tsela e iketsang (AOI) & tlhahlobo ea pono
● Tlhahlobo ea X-ray ha ho hlokahala
● Teko ea tšebetso ha ho hlokahala
Lisebelisoa le Thepa
Lisebelisoa tsa ka tlung tsa PCB ShinTech li khona ho fihla ho 40,000 m2ka khoeli ea ho etsoa ha PCB.Ka nako e ts'oanang PCB ShinTech e na le mela e 15 ea SMT le mela e 3 ea lesoba ka tlung.Li-PCB tsa hau ha li mohla li hlahisoang ke moreki ea tlase ho tsoa letamong le leholo la lifeme.Ho fihlela ts'ebetso e ikhethang ea boleng ho tsoa kopanong ea PCB, re tsoela pele ho tsetela lisebelisoa tsa morao-rao tse lumellang ho nepahala ho hlokahalang bakeng sa ts'ebetso eohle ea kopano, ho kenyeletsoa X Ray, peista ea solder, khetho le sebaka le tse ling.
1. PCB
2. PCBA
Setifikeiti
Litsi tsa rona li na le litifikeiti tsena:
● ISO-9001: 2015
● ISO14001: 2015
● TS16949: 2016
● UL: 2019
● AS9100: 2012
● RoHS: 2015
Romella potso ea hau kapa kopo ea quote ho rona hosales@pcbshintech.comho hokahana le e mong oa baemeli ba rona ba thekiso ba nang le boiphihlelo ba indasteri ho o thusa ho fumana mohopolo oa hau ho mmarakeng.
