HDI PCB Ho etsa --- Ho Immersion Gold holim'a kalafo
E ngotsoe:La 28 Pherekhong 2023
Lihlopha: Li-blogs
Li-tag: pcb,pcba,kopano ea pcb,tlhahiso ea pcb, PCB holim'a qetello
ENIG e bua ka Electroless Nickel / Immersion Gold, eo hape e bitsoang lik'hemik'hale Ni/Au, ts'ebeliso ea eona e se e tumme hona joale ka lebaka la boikarabello bakeng sa melaoana e se nang lead le ho nepahala ha eona bakeng sa sebopeho sa hajoale sa PCB sa HDI le li-pitches tse ntle lipakeng tsa BGAs le SMTs. .
ENIG ke ts'ebetso ea lik'hemik'hale e kopanyang koporo e pepesitsoeng ka Nickel le Khauta, kahoo e na le moalo o habeli oa tšepe ea tšepe, 0.05-0.125 µm (2-5μ inches) ea qoeliso ea Khauta (Au) ho feta 3-6 µm (120- 240μ inches) ea nickel e se nang motlakase (Ni) joalo ka ha ho fanoe ka tšupiso e tloaelehileng.Nakong ea ts'ebetso, Nickel e kenngoa holim'a koporo e entsoeng ka palladium-catalyzed, e lateloa ke khauta e khomarelang sebaka sa nickel-plated ka phapanyetsano ea limolek'hule.Ho roala ha nickel ho sireletsa koporo ho tloha ho oxidation le ho sebetsa e le bokaholimo bakeng sa kopano ea PCB, hape e le mokoallo oa ho thibela koporo le khauta hore li se ke tsa fallela ho tse ling, 'me lesela le tšesaane haholo la Au le sireletsa lera la nickel ho fihlela ts'ebetso ea soldering le fana ka tlaase. ho hanyetsana le ho koloba hantle.Botenya bona bo lula bo tsitsitse ho pholletsa le boto ea wiring e hatisitsoeng.Motsoako o eketsa haholo ho hanyetsa ho bola le ho fana ka sebaka se setle sa ho beoa ha SMT.
Ts'ebetso e kenyelletsa mehato e latelang:
1) Ho hloekisa.
2) Micro-etching.
3) Ho qoelisoa pele.
4) Ho sebelisa activator.
5) Ka mor'a ho qoelisoa.
6) Ho sebelisa nickel e se nang motlakase.
7) Ho sebelisa khauta ea ho qoelisoa.
Khauta e qoelisoang hangata e sebelisoa ka mor'a hore maske ea solder e sebelisoe, empa maemong a 'maloa, e sebelisoa pele ho ts'ebetso ea mask a solder.Ho hlakile hore sena se tla phahamisa litšenyehelo haholo haeba koporo eohle e koahetsoe ka khauta eseng feela se pepesitsoeng ka mor'a mask a solder.
Setšoantšo se kaholimo se bonts'ang phapang lipakeng tsa ENIG le likhakanyo tse ling tsa khauta.
Ka botekgeniki, ENIG ke tharollo e nepahetseng e se nang lead bakeng sa li-PCB ho tloha ha e na le polane ea eona e kholo le homogeneity, haholoholo bakeng sa HDI PCB e nang le VFP, SMD le BGA.ENIG e ratoa maemong ao ho ona ho batloang mamello e tiileng bakeng sa likarolo tsa PCB joalo ka masoba a petelitsoeng le theknoloji e lekanang le khatiso.ENIG e loketse hape bakeng sa terata (Al) bonding soldering.ENIG e khothaletsoa ka matla bakeng sa litlhoko tsa liboto tse kenyelletsang mefuta ea soldering hobane e tsamaellana le mekhoa e fapaneng ea kopano joalo ka SMT, flip chips, through-Hole soldering, wire bonding, le press-fit technology.Electroless Ni/Au surface e eme ka li-cycle tse ngata tsa mocheso le ho sebetsana le litšila.
ENIG e bitsa chelete e ngata ho feta HASL, OSP, Silivera ea ho qoelisoa le ho Immersion Tin.Black pad kapa Black phosphorus pad ka linako tse ling e etsahala nakong ea ts'ebetso moo phosphorous e ngata pakeng tsa lihlopha e bakang likhokahano tse fosahetseng le libaka tse robehileng.Bothata bo bong bo hlahang ke lintho tse sa rateheng tsa makenete.
Melemo:
- Flat Surface - E ntle bakeng sa Kopano ea molumo o motle (BGA, QFP…)
- Ho ba le solderability e ntle haholo
- Long Shelf Life (likhoeli tse ka bang 12)
- Khanyetso e ntle ea ho kopana
- E ntle bakeng sa li-PCB tse teteaneng tsa koporo
- E loketse bakeng sa PTH
- E ntle bakeng sa li-flip chips
- E loketse Press-fit
- Wire Bondable (Ha ho Sebelisoa Mohala oa Aluminium)
- E babatsehang conductivity ea motlakase
- Phallo e ntle ea mocheso
Mathata:
- E turu
- Letlapa le letšo la phosphorus
- Tšitiso ea motlakase, Tahlehelo e Bohlokoa ea Letšoao ka maqhubu a phahameng
- Ha e khone ho sebetsa hape
- Ha e Lokelane le Lipampiri tsa ho Kopana le Touch
Lisebelisoa tse tloaelehileng haholo:
- Likarolo tse rarahaneng tsa bokaholimo tse kang Ball Grid Arrays (BGAs), Quad Flat Packages (QFPs).
- Li-PCB tse nang le Mixed Package Technologies, press-fit, PTH, wire bonding.
- Li-PCB tse nang le khokahanyo ea mohala.
- Lisebelisoa tse phahameng tsa ts'epo, mohlala, li-PCB liindastering moo ho nepahala le ho tšoarella ho leng bohlokoa, joalo ka lisebelisoa tsa sefofane, sesole, bongaka le bareki ba maemo a holimo.
Joaloka mofani ea etellang pele oa litharollo tsa PCB le PCBA ea nang le boiphihlelo ba lilemo tse fetang 15, PCB ShinTech e khona ho fana ka mefuta eohle ea masela a boto ea PCB e nang le pheletso e fapaneng.Re ka sebetsa le uena ho theha ENIG, HASL, OSP le liboto tse ling tsa potoloho tse etselitsoeng litlhoko tsa hau tse ikhethileng.Re na le li-PCB tsa tlholisano tsa litšepe tsa mantlha / aluminium le tse thata, tse tenyetsehang, tse thata, tse nang le thepa e tloaelehileng ea FR-4, TG e phahameng kapa lisebelisoa tse ling.
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Nako ea poso: Jan-28-2023
