HDI PCB e etsa fektheri e itirisang ea PCB --- ENEPIG PCB top finish
E ngotsoe:La 3 Hlakola, 2023
Lihlopha: Li-blogs
Li-tag: pcb,pcba,kopano ea pcb,tlhahiso ea pcb, PCB holim'a qetello,HDI
ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) ha se sebaka sa PCB se sebelisoang hangata hajoale ha se ntse se tsebahala haholo indastering ea tlhahiso ea PCB.E sebetsa bakeng sa mefuta e mengata ea kopo mohlala, liphutheloana tse fapaneng tsa holim'a metsi le liboto tsa PCB tse tsoetseng pele haholo.ENEPIG ke mofuta o ntlafalitsoeng oa ENIG, ka kenyelletso ea Palladium layer (0.1-0.5 µm/4 to 20 μ'') lipakeng tsa Nickel (3-6 µm/120 – 240 μ'') le Khauta (0,02- 0,05 µm/1 ho isa ho 2 μ'') ka ho qoelisoa ka lik'hemik'hale fekthering ea PCB.Palladium e sebetsa e le tšitiso ho sireletsa lera la nickel hore le se ke la bola ke Au, e thusang ho thibela "pad e ntšo" hore e se ke ea etsahala e leng taba e kholo ho ENIG.
Haeba ho se na tlamahano ea tekanyetso, ENEPIG e bonahala e le khetho e betere maemong a mangata haholo-holo a litlhoko tse hlokahalang haholo tse nang le mefuta e mengata ea liphutheloana tse kang, ka likoti, SMT, BGA, wire bonding, le press fit, ha ho bapisoa le ENIG.
Ho feta moo, ho tšoarella ho hoholo le ho hanyetsa ho etsa hore e lule e phela nako e telele.Seaparo sa ho qoelisoa se tšesaane se etsa hore ho beoa ha likarolo le ho soasoa ho be bonolo ebile ho ka tšeptjoa.Ho feta moo, ENEPIG e fana ka khetho e phahameng e tšepahalang ea Wire Bonding.
Melemo:
• Ho bonolo ho sebetsa
• Black Pad Free
• Sebaka se bataletseng
• Bophelo bo botle ba shelofo (likhoeli tse 12+)
• Ho lumella lipotoloho tse ngata tsa phalliso
• E ntle bakeng sa Plated Through Holes
• E ntle bakeng sa Fine Pitch / BGA / Small Components
• E ntle bakeng sa Lebitso la ho ama / Push Contact
• Higher Reliability Wire Bonding (khauta/aluminium) ho feta ENIG
• Tšepahalang e matla ea Solder ho feta ENIG;E theha li-joints tse tšepahalang tsa Ni/Sn
• E lumellana haholo le li-solders tsa Sn-Ag-Cu
• Litlhahlobo tse Bonolo
Mathata:
• Ha se bahlahisi bohle ba ka fanang ka eona.
• Ho koloba ho hlokahala nako e telele.
• Litšenyehelo tse phahameng
• Ho sebetsa hantle ho angoa ke maemo a plating
• E ka 'na ea se ke ea tšepahala hakana bakeng sa khokahanyo ea terata ea khauta ha e bapisoa le Soft Gold
Lisebelisoa tse tloaelehileng haholo:
Likopano tsa High Density, Complex or Mixed Package Technologies, High Performance Devices, Wire Bonding application, IC carrier PCBs, joalo-joalo.
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Nako ea poso: Feb-02-2023
