Moetsi ea etellang pele oa Kopano ea PCB: Lits'ebeletso tsa turnkey ka botlalo le lits'ebeletso tsa turnkey
PCB ShinTech ke e 'ngoe ea lik'hamphani tse tsebahalang tsa PCB Assembly naheng ea China, tse nang le boiphihlelo ba lilemo tse 15+ ho fana le ho kopanya liboto tsa potoloho.Setsi sa rona sa morao-rao se sebelisa lisebelisoa tsa morao-rao tsa SMT le Through-hole ho etsa lihlahisoa tsa boleng le tse tšepahalang ka nako e loketseng bakeng sa bareki ba rona.
ditshebeletso
LITŠEBELETSO TSA TURNKEY LE KAROLO EA KAROLO
Tšebeletso ea kopano ea PCB ka botlalo
Ka kopano e felletseng ea li-turnkey, re sebetsana le likarolo tsohle tsa morero oa kopano: ho etsa liboto tsa potoloho tse se nang letho, lisebelisoa tsa ho fumana lisebelisoa le likaroloana, welding, kopano, ho hokahanya thepa le feme ea kopano ka linako tse etellang pele, ho fetella / ho nkeloa sebaka, joalo-joalo, tlhahlobo le liteko, le ho isa lihlahisoa ho bareki.
Ts'ebeletso ea kopano ea Kitted Turnkey / karolo ea PCB
Karolo e itseng / kitted turnkey e lumella bareki ho laola mokhoa o le mong kapa tse ling tse thathamisitsoeng ka holimo.Hangata bakeng sa lits'ebeletso tsa li-turnkey tse sa fellang, moreki o re romella lisebelisoa (kapa thepa e sa fellang haeba e se likarolo tsohle tse fanoeng) mme re hlokomela tse ling kaofela.
Bakeng sa ba tsebang hantle seo ba se batlang ho li-PCB tsa bona, empa mohlomong ha ba na nako kapa thepa ea ho bokana, kopano ea boto ea potoloho e hatisitsoeng ke khetho e phethahetseng.O ka reka karolo kapa kaofela ha likarolo le likarolo tseo u li hlokang, 'me re tla u thusa ho bokella PCBs.Sena se ka u thusa ho ba le taolo e ntle ea litšenyehelo tsa tlhahiso le ho tseba seo u ka se lebellang ka liboto tsa potoloho tse phethiloeng.
Ho sa tsotellehe hore na u khetha tšebeletso ea li-turnkey, re etsa bonnete ba hore li-PCB tse se nang letho li etsoa ka mokhoa o ikhethileng, li bokelloa hantle le ho lekoa ka hloko.Ka lits'ebetso tse ikemetseng, re khona ho etsa hore projeke ea hau e phetheloe hantle ho tloha ho li-prototype ho isa tlhahisong e kholo ea molumo.
LEAD TIME
Nako ea rona ea ho etella pele bakeng sa litaelo tsa kopano ea turkey PCB hangata ke libeke tse 2-4, tlhahiso ea PCB, ho fumana likarolo, le kopano e tla phethoa ka nako ea pele.Bakeng sa tšebeletso ea kitted PCBA, matsatsi a 3-7 a ka lebelloa haeba liboto tse se nang letho, likarolo le likarolo tse ling li se li loketse, 'me li ka ba khutšoanyane joaloka matsatsi a 1-3 bakeng sa prototypes kapa quickturn.
1-3 matsatsi a mosebetsi
● 10 pcs Maximum
3-7 matsatsi a mosebetsi
● 500 pcs Maximum
7-28 matsatsi a mosebetsi
● Ka holimo ho 500 pcs
Thepa e reriloeng e boetse e Fumaneha bakeng sa Tlhahiso ea Molumo o Phahameng
Nako e khethehileng ea ho etella pele e ipapisitse le litlhaloso tsa sehlahisoa sa hau, bongata le hore na ke nako ea ho reka haholo.Ka kopo ikopanye le moemeli oa hau oa thekiso bakeng sa lintlha.
Qotsa
Ka kopo kopanya lifaele tse latelang ho faele e le 'ngoe ea ZIP 'me u ikopanye le rona hosales@pcbshintech.combakeng sa qotso:
1. PCB Design File.Ka kopo, kenyelletsa li-gerbers kaofela (bonyane re hloka li-copper layers), lilae tsa peista ea solder, le li-layer tsa silika).
2. Khetha le Sebaka (Centroid).Lintlha li tlameha ho kenyelletsa sebaka sa karolo, lipotoloho le baqapi ba litšupiso.
3. Bill of Materials (BOM).Tlhahisoleseding e fanoeng e tlameha ho ba ka mokhoa o ka baloang ka mochine (Excelleon e khethoa).BOM ea hau e hlakotsoeng e lokela ho kenyelletsa:
● Bongata ba karolo ka 'ngoe.
● Moqapi oa litšupiso - khoutu ea alphanumeric e hlalosang sebaka sa karolo.
● Morekisi le/kapa MFG Part Number (Digi-Key, Mouser, Etc.)
● Tlhaloso ea karolo
● Tlhaloso ea sephutheloana (QFN32, SOIC, 0805, joalo-joalo sephutheloana se thusa haholo empa ha se hlokehe).
● Mofuta (SMT, Thru-Hole, Fine-pitch, BGA, joalo-joalo).
● Bakeng sa kopano e sa fellang, ka kopo, hlokomela ho BOM, "U se ke Ua Kena" kapa "U se ke Ua Load" bakeng sa likarolo tse ke keng tsa behoa.
Khoasolla litlhoko tsa rona tsa faele:
Bokhoni ba Kopano
Bokhoni ba kopano ea PCB ea PCB ShinTech bo kenyelletsa Surface Mount Technology (SMT), Thru-hole, le theknoloji e tsoakiloeng (SMT e nang le Thru-hole) bakeng sa ho beoa ka mahlakoreng a mabeli.Passive Components e nyane joalo ka sephutheloana sa 01005, Ball Grid Arrays (BGA) e nyane joalo ka .35mm pitch e nang le X-Ray e hlahlobiloeng, le tse ling:
Bokhoni ba Kopano ea SMT
● Fetola ho ea ho 01005 boholo
● Ball Grid Array (BGA)
● Ultra-Fine Ball Grid Array (uBGA)
● Quad Flat Pack No-Lead (QFN)
● Sephutheloana sa Quad Flat (QFP)
● Plastic Leaded Chip Carrier (PLCC)
● SOIC
● Sephutheloana se On-Package (PoP)
● Liphutheloana tse Nyane tsa Chip (Pitch ea 0.2 mm)
Kopano ea Ka-Hole
● Automated and Manual through-Hole Assembly
● Thru-hole thekenoloji kopano e sebediswa ho bopa dikgokelo matla ho feta bapisoa le holim'a thaba thekenoloji ka lebaka la ho isang mathang ho pholletsa le boto potoloho.Hangata mofuta ona oa kopano o khethoa bakeng sa tlhahlobo le prototyping e hlokang ho fetoloa ha likaroloana le lits'ebetso tse hlokang ts'epo e phahameng.
● Mekhoa ea ho kenya ka har'a lesoba hangata e boloketsoe likarolo tse ngata kapa tse boima ho feta tse kang electrolytic capacitor kapa electromechanical relays tse hlokang matla a maholo ho tšehetsa.
BGA Bokhoni ba Kopano
● Ho behoa ka mokhoa o itekanetseng oa Ceramic BGA, Plastic BGA, MBGA
● Ho netefatsa ha BGA e sebelisa mokhoa oa sebele oa tlhahlobo ea X-ray ea HD ho felisa bofokoli ba kopano le mathata a ho soahla, joalo ka loose soldering, cold soldering, solder balls le peste bridging.
● Ho Tlosa le ho Fetola Li-BGA's & MBGA, bonyane ba 0.35mm, BGA e kholo (ho fihla ho 45mm), BGA Rework le Reballing.
Melemo ea Kopano e Kopanetsoeng
● Mixed Assembly - Through-Hole, SMT le BGA likarolo li behiloe ho PCB.Theknoloji e tsoakiloeng ka mahlakoreng a le mong kapa a mabeli, SMT (Surface Mount) le lesoba la ho kopanya PCB.BGA e nang le mahlakoreng a le mong kapa a mabeli le ho kenngoa ha micro-BGA le ho sebetsa bocha ka tlhahlobo ea X-ray ea 100%.
● Khetho bakeng sa likarolo tse se nang sebopeho sa holim'a marulelo.
Ha ho solder pente e sebelisitsoeng.Ts'ebetso ea kopano e ikhethileng ho lumellana le litlhoko tse khethehileng tsa bareki ba rona.
Taolo ea Boleng
Re sebelisa mekhoa e phethahetseng ea ho laola boleng.
● Li-PCB tsohle tse se nang letho li tla lekoa ka motlakase e le mokhoa o tloaelehileng.
● Manonyeletso a bonahalang a tla hlahlojoa ka leihlo kapa AOI (automated optical inspection).
● Likopano tsa pele li hlahlojoa ntle ho marang-rang ke bahlahlobi ba nang le phihlelo ba boleng.
● Ha ho hlokahala, tlhahlobo ea X-ray ea ka tlung ea libaka tsa BGA (Ball Grid Array) ke mokhoa o tloaelehileng.
Lisebelisoa tsa Kopano ea PCB le Lisebelisoa
PCB ShinTech e na le mela e 15 ea SMT, mela e 3 ea lesoba, mela e 3 ea ho qetela ea kopano ka tlung.Ho fihlela ts'ebetso ea boleng bo holimo ho tsoa kopanong ea PCB, re tsoela pele ho tsetela lisebelisoa tsa morao-rao, ho nchafatsa boitsebelo har'a basebetsi ba netefatsang hore BGA's le liphutheloana tsa 01005 li tla ba teng hammoho le likarolo tsohle tse fumanehang hangata.Linakong tse sa tloaelehang tseo re bang le bothata ba ho beha likarolo, PCB ShinTech e na le lisebelisoa tsa ka tlung ho hlophisa bocha mofuta o mong le o mong oa karolo.
Lethathamo la Lisebelisoa tsa Kopano ea PCB
| Moetsi | Mohlala | Tshebetso |
| Comiton | MTT-5B-S5 | Conveyor |
| GKG | G5 | Mohatisi oa solderpaste |
| YAMAHA | YS24 | Khetha le Sebaka |
| YAMAHA | YS100 | Khetha le Sebaka |
| ANTOM | Solisys-8310irp | Reflow Oven |
| JT | NS-800 | Reflow Oven |
| OMRON | VT-RNS-ptH-M | AOI |
| Qijia | QJCD-5T | Ontong |
| Suneast | SST-350 | Wave Solder |
| ERSA | VERSEFOW-335 | Khetha Solder |
| Lethathamo la lintlha tsa Glenbrook Technologies, Inc. | CMX002 | X-Ray |
PCB & Electronic Assembly Process
Kahohle kamoo ho ka khonehang, re tla sebelisa lits'ebetso tsa othomathike ho beha likarolo ho PCB ea hau e se nang letho, re sebelisa data ea hau ea ho khetha le ho beha CAD.Boemo ba likarolo, sebopeho le boleng ba solder hangata li tla netefatsoa ho sebelisoa Automatic Optical Inspection.
Lihlopha tse nyenyane haholo li ka behoa ka letsoho le ho hlahlojoa ka leihlo.Lisebelisoa tsohle li tla ba ho maemo a Sehlopha sa 1.Haeba o hloka Sehlopha sa 2 kapa sa 3, ka kopo re kope ho qotsa.
Hopola ho lumella nako ho kenyelletsa nako ea kopano e qotsitsoeng ho re nolofalletsa ho kenya BOM ea hau.Re tla eletsa ho eketseha ha nako ea ho fana ka quote ea rona.
Romella potso ea hau kapa kopo ea quote ho rona hosales@pcbshintech.comho hokahana le e mong oa baemeli ba rona ba thekiso ba nang le boiphihlelo ba indasteri ho o thusa ho fumana mohopolo oa hau ho mmarakeng.
