Mokhoa oa ho khetha Surface Finish bakeng sa Moralo oa hau oa PCB
Ⅱ Tekolo le Papiso
E ngotsoe: La 16 Nov, 2022
Lihlopha: Li-blogs
Li-tag: pcb,pcba,kopano ea pcb,tlhahiso ea pcb, PCB holim'a qetello
Ho na le malebela a mangata mabapi le pheletso ea bokaholimo, joalo ka HASL e se nang lead, e na le bothata ba ho ba le moea o tsitsitseng.Electrolytic Ni/Au e hlile e theko e boima 'me haeba khauta e ngata e kenngoa holim'a pad, e ka lebisa ho brittle solder joints.Ho qoelisoa thini na solderability degradation ka mor'a ho pepesehela lipotoloho multiple mocheso, e le ka holimo le tlase lehlakoreng PCBA reflow tshebetso, joalo-joalo. Phapang ea ka holimo holim'a finishes e ne e hlokahala ho hlokomela ka ho hlaka.Tafole e ka tlase e bonts'a tlhahlobo e thata bakeng sa liphetho tse sebelisoang hangata tsa liboto tsa potoloho tse hatisitsoeng.
Lethathamo la 1 Tlhaloso e khuts'oane ea ts'ebetso ea tlhahiso, melemo le likotsi tsa bohlokoa, le lits'ebetso tse tloaelehileng tsa liphetho tse tsebahalang tse se nang lead tsa PCB.
| PCB Surface Qetella | Tshebetso | Botenya | Melemo | Mefokolo | Lisebelisoa tse Tloaelehileng |
| HASL e se nang ketapele | Liboto tsa PCB li qoelisoa ka bateng ea thini e qhibilihisitsoeng 'me joale e ne e butsoe ke lithipa tsa moea o chesang bakeng sa liphaphatha tse bataletseng le ho tlosa solder e feteletseng. | 30µin(1µm) -1500µin(40µm) | Solderability e ntle;E fumaneha haholo;E ka lokisoa / ea sebetsoa bocha;Shelofo e telele | Libaka tse sa lekaneng;Tšisinyeho ea mocheso;Ho kolobisa hampe;Solder borokho;PTHs e kentsoeng. | E sebetsa ka ho pharaletseng;E loketse li-pads tse kholoanyane le sebaka;Ha e loketse HDI e nang le <20 mil (0.5mm) sekontiri se setle le BGA;Ha e ntle bakeng sa PTH;Eseng sutu bakeng sa PCB teteaneng koporo;Ka tloaelo, kopo: Liboto tsa potoloho bakeng sa tlhahlobo ea motlakase, ho soasoa ka letsoho, lisebelisoa tse ling tsa elektroniki tse sebetsang hantle joalo ka sefofane le lisebelisoa tsa sesole. |
| OSP | Ho sebelisa motsoako ka lik'hemik'hale holim'a liboto tse etsang lera la organic metallic ho sireletsa koporo e pepeneneng ho mafome. | 46µin (1.15µm) -52µin(1.3µm) | Theko e tlase;Lipalo li tšoana ebile li bataletse;Solderability e ntle;E ka ba yuniti e nang le lisebelisoa tse ling tse holimo;Tshebetso e bonolo;E ka sebetsa hape (ka har'a workshop). | E hloahloa ho tšoara;Bophelo bo bokhutšoanyane ba sethala.Ho hasana ha solder ho fokolang haholo;Solderability degradation le phahameng temp & lipotoloho;Nonconductive;Ho thata ho hlahloba, tlhahlobo ea ICT, likhathatso tsa ionic le litaba tsa khatiso | E sebetsa ka ho pharaletseng;E loketse hantle bakeng sa SMT / li-pitches tse ntle / BGA / likaroloana tse nyane;Sebeletsa mapolanka;Ha e ntle bakeng sa PTHs;Ha e loketse theknoloji ea crimping |
| ENIG | Ts'ebetso ea lik'hemik'hale e kopanyang koporo e pepesitsoeng ka Nickel le Khauta, kahoo e na le likarolo tse peli tsa tšepe. | 2µin (0.05µm)– 5µin (0.125µm) ea Khauta ho feta 120µin (3µm)– 240µin (6µm) ea Nickel | Excellent solderability;Liphanele li bataletse ebile li tšoana;Al terata bendability;Khanyetso e fokolang ea ho kopana;Bophelo ba nako e telele;Ho hanyetsa kutu e ntle le ho tšoarella | "Black Pad" ho tšoenyeha;Tahlehelo ea mats'oao bakeng sa lits'ebetso tsa botšepehi ba matšoao;ha e khone ho sebetsa bocha | E ntle bakeng sa Kopano ea sekontiri se setle le ho beoa ha holim'a metsi ho rarahaneng (BGA, QFP…);E ntle bakeng sa mefuta e mengata ea Soldering;E ratoang bakeng sa PTH, tobetsa ho lekana;Bondable ka Wire;Khothaletsa PCB e nang le ts'ebeliso e phahameng e ts'epahalang joalo ka sefofane, sesole, bareki ba bongaka le ba maemo a holimo, joalo-joalo;Ha e khothalletsoe bakeng sa li-Touch Contact Pads. |
| Electrolytic Ni/Au (Khauta e bonolo) | 99.99% e hloekileng - 24 carat Khauta e sebelisitsoeng holim'a nickel layer ka mokhoa oa electrolytic pele ho soldermask. | 99.99% khauta e hloekileng, 24 Karat 30µin (0.8µm) -50µin (1.3µm) ho feta 100µin (2.5µm) -200µin (5µm) ea Nickel | Sebaka se thata, se tšoarellang;Conductivity e kholo;Ho batalla;Al terata bendability;Khanyetso e fokolang ea ho kopana;Bophelo ba shelofo e telele | E turu;Au embrittlement haeba e tenya haholo;Litšitiso tsa moralo;Ts'ebetso e eketsehileng / mosebetsi o matla;Eseng sutu bakeng sa soldering;Ho roala ha ho tšoane | E sebelisoa haholo ho khokahanyo ea terata (Al & Au) ka har'a sephutheloana sa chip joalo ka COB (Chip on Board) |
| Electrolytic Ni/Au (Khauta e thata) | 98% e hloekileng - 23 carat Khauta e nang le li-hardeners tse kentsoeng bateng ea ho pola e sebelisoang holim'a nickel layer ka mokhoa oa electrolytic. | 98% khauta e hloekileng, 23 Karat30µin(0.8µm) -50µin(1.3µm) ho feta 100µin(2.5µm) -150µin(4µm) ea Nickel | Excellent solderability;Liphanele li bataletse ebile li tšoana;Al terata bendability;Khanyetso e fokolang ea ho kopana;E ka sebetsa hape | Ho senya (ho tšoara le ho boloka) ho senya sebakeng se phahameng sa sebabole;Likhetho tse fokolitsoeng tsa phepelo ea thepa ho tšehetsa pheletso ena;Fensetere e khuts'oane ea ts'ebetso lipakeng tsa mekhahlelo ea kopano. | Haholo-holo e sebelisoa bakeng sa khokahanyo ea motlakase joalo ka lihokelo tsa moeli (monoana oa khauta), liboto tsa sejari sa IC (PBGA/FCBGA/FCCSP...) , likonopo, likhokahano tsa betri le lipampiri tse ling tsa tlhahlobo, joalo-joalo. |
| Ho qoelisoa Ag | Lera la Silver le behiloe holim'a koporo ka mokhoa o se nang motlakase ka mor'a etch empa pele ho soldermask. | 5µin(0.12µm) -20µin(0.5µm) | Excellent solderability;Liphanele li bataletse ebile li tšoana;Al terata bendability;Khanyetso e fokolang ea ho kopana;E ka sebetsa hape | Ho senya (ho tšoara le ho boloka) ho senya sebakeng se phahameng sa sebabole;Likhetho tse fokolitsoeng tsa phepelo ea thepa ho tšehetsa pheletso ena;Fensetere e khuts'oane ea ts'ebetso lipakeng tsa mekhahlelo ea kopano. | Mefuta e meng ea moruo ho ENIG bakeng sa Melato e Ntle le BGA;E loketseng bakeng sa ts'ebeliso ea matšoao a lebelo le phahameng;E ntle bakeng sa li-switches tsa membrane, tšireletso ea EMI, le khokahanyo ea terata ea aluminium;E loketse ho tobetsa hantle. |
| Ho qoelisoa ka metsing Sn | Ka bateng ea lik'hemik'hale e se nang motlakase, lesela le lesoeu le tšesaane la Tin le beha ka kotloloho holim'a koporo ea liboto tsa potoloho e le tšitiso ea ho qoba oxidation. | 25µin (0.7µm) -60µin(1.5µm) | Molemo ka ho fetisisa bakeng sa theknoloji e loketseng mochine oa khatiso;E boloka litšenyehelo;Planar;Excellent solderability (ha e ncha) le ho tšepahala;Bophatlalatsi | Solderability degradation le phahameng temps & lipotoloho;Lesenke le pepesitsoeng holim'a kopano ea ho qetela le ka senyeha;Ho sebetsana le mathata;tin Wiskring;Ha e tšoanelehe bakeng sa PTH;E na le Thiourea, Carcinogen e tsebahalang. | Khothaletsa bakeng sa lihlahisoa tse ngata;E ntle bakeng sa ho beoa ha SMD, BGA;Molemo ka ho fetisisa bakeng sa ho lekana ha khatiso le li-backplanes;Ha e khothalletsoe bakeng sa PTH, li-switches, le tšebeliso ea limaske tse peelable |
Letlapa2 Tekolo ea thepa e tloaelehileng ea PCB Surface Finishes ea sejoale-joale mabapi le tlhahiso le ts'ebeliso
| Tlhahiso ea lisebelisoa tse ngata tse sebelisoang ka holimo | |||||||||
| Thepa | ENIG | ENEPIG | Khauta e Bonolo | Khauta e thata | IAg | ISn | HASL | HASL- LF | OSP |
| Ho tuma | Phahameng | Tlase | Tlase | Tlase | Mahareng | Tlase | Tlase | Phahameng | Mahareng |
| Litšenyehelo tsa Ts'ebetso | Holimo (1.3x) | Holimo (2.5x) | E phahameng ka ho fetisisa (3.5x) | E phahameng ka ho fetisisa (3.5x) | Mahareng (1.1x) | Mahareng (1.1x) | Tlase (1.0x) | Tlase (1.0x) | Tlase (0.8x) |
| Depositi | Ho qoelisoa metsing | Ho qoelisoa metsing | Electrolytic | Electrolytic | Ho qoelisoa metsing | Ho qoelisoa metsing | Ho qoelisoa metsing | Ho qoelisoa metsing | Ho qoelisoa metsing |
| Shelf Life | Nako e telele | Nako e telele | Nako e telele | Nako e telele | Mahareng | Mahareng | Nako e telele | Nako e telele | Khutšoane |
| RoHS e lumellana | Ee | Ee | Ee | Ee | Ee | Ee | No | Ee | Ee |
| Surface Co-planarity bakeng sa SMT | E kgabane | E kgabane | E kgabane | E kgabane | E kgabane | E kgabane | Mafutsana | E ntle | E kgabane |
| Koporo e pepesitsoeng | No | No | No | Ee | No | No | No | No | Ee |
| Ho tshoara | Tloaelehileng | Tloaelehileng | Tloaelehileng | Tloaelehileng | Bohlokoa | Bohlokoa | Tloaelehileng | Tloaelehileng | Bohlokoa |
| Boiteko ba Ts'ebetso | Mahareng | Mahareng | Phahameng | Phahameng | Mahareng | Mahareng | Mahareng | Mahareng | Tlase |
| Bokhoni ba ho Rework | No | No | No | No | Ee | Ha e khothalletsoe | Ee | Ee | Ee |
| Ho Hlokahala Thermal Cycles | ngatafatsi | ngatafatsi | ngatafatsi | ngatafatsi | ngatafatsi | 2-3 | ngatafatsi | ngatafatsi | 2 |
| Taba ea Whisk | No | No | No | No | No | Ee | No | No | No |
| Thermal Shock (PCB MFG) | Tlase | Tlase | Tlase | Tlase | Tlase Haholo | Tlase Haholo | Phahameng | Phahameng | Tlase Haholo |
| Bohanyetsi bo tlase / Lebelo le Phahameng | No | No | No | No | Ee | No | No | No | N/A |
| Lisebelisoa tsa lisebelisoa tse ngata tse sebelisoang hangata | |||||||||
| Lisebelisoa | ENIG | ENEPIG | Khauta e Bonolo | Khauta e Thata | IAg | ISn | HASL | LF-HASL | OSP |
| E thatafetse | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee |
| Flex | E thibetsoe | E thibetsoe | Ee | Ee | Ee | Ee | Ee | Ee | Ee |
| Flex-Rigid | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ha ea Ratoa |
| Pitch e Ntle | Ee | Ee | Ee | Ee | Ee | Ee | Ha ea Ratoa | Ha ea Ratoa | Ee |
| BGA & μBGA | Ee | Ee | Ee | Ee | Ee | Ee | Ha ea Ratoa | Ha ea Ratoa | Ee |
| Multiple Solderability | Ee | Ee | Ee | Ee | Ee | Ee | Ee | Ee | E thibetsoe |
| Flip Chip | Ee | Ee | Ee | Ee | Ee | Ee | No | No | Ee |
| Tobetsa Fit | E thibetsoe | E thibetsoe | E thibetsoe | E thibetsoe | Ee | E kgabane | Ee | Ee | E thibetsoe |
| Ka-Hole | Ee | Ee | Ee | Ee | Ee | No | No | No | No |
| Wire Bonding | Ee (Al) | Ho joalo (Al, Au) | Ho joalo (Al, Au) | Ee (Al) | E feto-fetohang (Al) | No | No | No | Ee (Al) |
| Solder Wettability | E ntle | E ntle | E ntle | E ntle | Hantle haholo | E ntle | Mafutsana | Mafutsana | E ntle |
| Solder Kopanelo Botšepehi | E ntle | E ntle | Mafutsana | Mafutsana | E kgabane | E ntle | E ntle | E ntle | E ntle |
Bophelo ba lishelefo ke ntho ea bohlokoa eo u lokelang ho e nahana ha u etsa kemiso ea hau ea tlhahiso.Shelf Lifeke fensetere ea ts'ebetso e fanang ka phetisetso ea ho ba le ts'ebetso e felletseng ea PCB.Ho bohlokoa ho etsa bonnete ba hore li-PCB tsohle tsa hau li bokane nakong ea sethala.Ntle le lisebelisoa le ts'ebetso e etsang hore ho be le likhakanyo tse holimo, nako ea ho qeta nako e susumetsoa haholoka liphutheloana tsa PCB le polokelo.Mokopi o tiileng oa mokhoa o nepahetseng oa ho boloka o khothalelitsoeng ke litataiso tsa IPC-1601 o tla boloka ho ts'epahala le ho ts'epahala ha liphetho.
Lethathamo la 3 Bophelo ba Shelf Papiso har'a Liqeto tse Tloaelehileng tsa Surface Finishes tsa PCB
|
| Tloaelehileng SHEL BOPHELO | Tlhahiso ea Shelf Life | Rework Chance |
| HASL-LF | Likhoeli tse 12 | Likhoeli tse 12 | EE |
| OSP | Likhoeli tse 3 | 1 Likhoeli | EE |
| ENIG | Likhoeli tse 12 | Likhoeli tse 6 | NO* |
| ENEPIG | Likhoeli tse 6 | Likhoeli tse 6 | NO* |
| Electrolytic Ni/Au | Likhoeli tse 12 | Likhoeli tse 12 | NO |
| IAg | Likhoeli tse 6 | Likhoeli tse 3 | EE |
| ISn | Likhoeli tse 6 | Likhoeli tse 3 | EE ** |
* Bakeng sa ENIG le ENEPIG ho qeta potoloho ea ho tsosolosa ho ntlafatsa metsi a holim'a metsi le bophelo ba lishelefo boa fumaneha.
** Ha ho khothalletsoe ho sebetsa hape ka Tin ea lik'hemik'hale.
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Nako ea poso: Nov-16-2022
